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Flexible Printed Circuit Board(配線) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
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Flexible Printed Circuit Board Product List

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BigElec Fold - High Current Flexible Circuit Board - New Product

BigElec Fold - Customize flexible high-current wiring at a reasonable price.

BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.

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  • Printed Circuit Board

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FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

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  • Printed Circuit Board

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Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

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  • Wiring materials

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【TTL_展示会レポート】JPCAShow2024出展内容

『FPCのお困り事、一刀両断!』太洋テクノレックスは次代のニーズを敏感にキャッチし、フレキシブルな技術力でFPCを牽引!

フレキシブルプリント配線板 高周波フッ素複合材3層FPC  誘電特性に優れたフッ素複合材FPCでノイズ対策と狭小化を両立。同軸ケーブルからの転換にも好適。 MSAP工法~超細線FPC~  めっきアップで高精度、かつ高密度の微細配線を実現。配線断面の矩形性に優れ、イメージ通りの配線形成が可能。 透明FPC  優れた光透過性と耐熱性を備えチップ実装も可能なFPC。  製品のデザインを損なうことなく配線の引き回しが可能。 6層スタックビアFPC  ビアフィリング技術によるスタックビア構造で、さらなる高密度配線化を実現。配線スペースの有効活用により、設計自由度の向上に貢献。 基板検査システム【最終外観検査】  パッケージ・モジュール系基板に好適な光学分解能2.5µm仕様機が遂にラインナップ!   虚報低減AIシステム『ザイス』と欠陥検出AIシステムの採用で最終外観検査工程の効率化を大幅にアップしました。 マテハン・協働ロボット活用で自動化・効率化を提案 協働ロボット・産業用ロボットのシステムインテグレートや周辺機器など、お客様の業種や業態に適したFAシステムをご提案致します。

  • Printed Circuit Board

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Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!

The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials

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Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.

The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials

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Card edge compatible multi-layer separated flexible printed circuit board (FPC)

Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!

The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

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  • Board to FPC connector

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[Exhibition Report] We exhibited at NEPCON Japan 2025!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆   ~ Touch, Compare, Experience FPC! ~    ● Comparison of weight between rigid boards and FPC    ● Reduction of board area through high-density wiring    ● Difference in heat generation temperature due to copper thickness    ● Improved work efficiency with transparent FPC, etc.   ~ Technology Topics ~    ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results    ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring    ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via    ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆    By achieving teaching-less implementation through visual feedback control,    eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆    TY-VISION XAIS AI-based defect detection and false report reduction     ・M111SC (manual machine) high-definition (package) board × high-resolution inspection     ・M109SC (manual machine) diverse workpieces × large format

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots

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YFC "LVDS Type Coplanar (RFC)"

Co-planar structure with unilateral wiring! We have two types of lineup available.

The "LVDS Type Coplanar (RFC)" is a high-performance type of the YFC series. It uses liquid crystal polymer, which is a low dielectric constant material, for the base film to reduce transmission loss. There are two types available: one that uses polyimide film for insulation (RFC1) and another that uses liquid crystal polymer film (RFC2). Additionally, due to its coplanar structure with single-sided wiring, it offers the greatest flexibility among our LVDS-compatible flat cables. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Offers the greatest flexibility among LVDS types due to single-sided wiring *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials

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Membrane rubber implementation

Reliability born from years of experience. We provide high-quality wiring modules for keyboards with proven know-how.

【Features】 ■ Supports high switch stroke. ■ High key durability. ■ High mounting position accuracy (maximum ±0.2mm). 【Applications】 Flexible printed circuit board for switches with a click feel. *For more details, please refer to the PDF document or feel free to contact us.

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FPC forming (bending) delivery

Bend and deliver, ready to use. Achieve labor savings and space-saving design with FPC processing!

The "FPC Forming Processing Service" provided by Yamashita Material Co., Ltd. is a service that delivers flexible printed circuit boards (FPC) manufactured by our company, pre-bent into shapes according to customer specifications. The delivered FPC is in a state ready for immediate assembly, significantly reducing the labor hours at the assembly site and contributing to space-saving design. We can accommodate custom bending shapes and sizes upon consultation. We also have numerous examples of forming that utilize flexible materials such as liquid crystal polymer (LCP) and polyimide (PI), allowing us to flexibly respond to complex shapes.

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  • Other electronic parts

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Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts

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High Current Flexible Circuit Board [*FPC Technology Catalog Available]

Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

  • Printed Circuit Board

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Okin Electric Wire Co., Ltd. Flexible Printed Circuit Board (FPC) Catalog

A rich lineup tailored to various applications! Featuring flexible printed circuit boards!

This catalog features the "Flexible Printed Circuit Boards (FPC)" from Okiden Cable Co., Ltd. Our products are printed circuit boards designed to be bendable, using a thin insulating material (plastic film) as the substrate. They can accommodate component mounting and can be used as connection wiring. In addition to standard products, we offer "High-Flex FPC" that demonstrates excellent bending performance even in narrow spaces, and "Self-Supporting Sliding FPC" that can bend while standing in mid-air. 【Featured Products (Partial)】 ■ Standard Products (Single-Sided FPC, Double-Sided FPC, Flex-Rigid) ■ High-Flex FPC ■ High-Speed Transmission FPC ■ Long-Length FPC ■ Long-Length High-Speed Transmission FPC *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board

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High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.

The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials

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